Description
Description
L23-CPU Reballing Stencil Kit For iPhone A8-A16 Android Lower Steel Mesh Universal Magnetic Base BGA Tin Planting Table
Support Models:
Qualcomm: 765G, 778G, 845, 855, 865/870, 888/888 Plus, 8 Gen1, 8+ Gen1, 8 Gen2
MTK: 720, 800, 810, 900, 1000, 1100, 9000, 9200
Hisilicon: 710, 960, 970, 810, 980, 820/985, 990, 9000
iPhone: A8, A9, A10, A11, A12, A13, A14, A15, A16
Support Models:
Qualcomm: 765G, 778G, 845, 855, 865/870, 888/888 Plus, 8 Gen1, 8+ Gen1, 8 Gen2
MTK: 720, 800, 810, 900, 1000, 1100, 9000, 9200
Hisilicon: 710, 960, 970, 810, 980, 820/985, 990, 9000
iPhone: A8, A9, A10, A11, A12, A13, A14, A15, A16
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