High Precision Optical BGA Rework Station with HD Vision Alignment for Laptop Motherboard ECU PCB Chip Repair

Automotive ECU Repair
Server Motherboard Repair
Industrial PCB Repair
Mobile Phone Repair
Description
Description

● Independent three-temperature zone temperature control system

① Upper and lower temperature zone both are hot air heating, IR preheating zone for bright infrared heating, the temperature is accurately controlled at ± 2 ℃, the upper and lower temperature zone can be heated from the top of the components and the bottom of the PCB at the same time, meanwhile can be set up to 8 temperature control, so that the PCB board is heated uniformly, the bottom are the large IR preheating, so that the entire PCB temperature, to prevent deformation, to ensure that the welding effect, the heating plate can be independently controlled by the heating

② BGA chips and PCB boards can be hot air local heating at the same time, supplemented by a large area of infrared heaters on the bottom of the PCB board for preheating, can completely avoid the deformation of the PCB board in the rework process; through the selection of the upper temperature zone can be used individually or the lower temperature zone, and the free combination of upper and lower heaters Energy

③ Select high-precision K-type thermocouple closed-loop control and PID parameter self-tuning system; can simultaneously display four temperature curves and store multiple sets of user data, and has an instantaneous curve analysis function; external temperature measurement interface to achieve precision detection of the temperature, can be analyzed and calibrated at any time on the actual acquisition of the BGA temperature curve. It can also analyze, set and correct the curve of temperature parameters on the touch screen at any time.

● Precise Optical Alignment System: Adopting high-definition adjustable CCD color optical vision alignment system with beam splitting, zoom-in, zoom-out, and auto focus functions, and equipped with automatic chromatic aberration resolution and brightness adjustment device, which can adjust the clarity of the image; equipped with a 17” high-definition LCD monitor

● Versatile and user-friendly operating system

① Adopting high-definition touch screen man-machine interface, upper heating device and mounting head integrated design. Equipped with a variety of specifications of titanium alloy BGA nozzle, the nozzle can be rotated 360 ° arbitrary, easy to install and replacement

② The X and Y axes and the R angle are fine-tuned using micrometers for precise alignment and accuracy up to±0.01mm

Superior Features

 With 4 operating modesFour modes: remove, weld, mounting, semi-auto

.Percentage air speed adjustment, fan speed and chip temperature profile saved at the same time

 Slide rails drive the upper heating head, more precision

 

三、LW-07  technical parameters  

Total power

4800W

Upper heating power

800W

Lower heating power

1200W

Lower heating power

2700W1200W control

Power supply

(Single Phase)  AC 220V±10  50Hz

Positioning method

V-slot + universal fixture + laser positioning light for quick positioning

Temperature control

High-precision K-type thermocouple (Ksensor) closed loop control (Closed Loop), the upper and lower independent temperature measurement (+2 degree);

Electrical Selection

Highly sensitive touch screen+micro controllerstepper drive

Max PCB size

460×380mm  

Min PCB size

10×10mm

Temperature sensor

1pcs

Chip magnification

1-200 times

PCB thickness

0.5-8mm

Applicable chips

0.8mm-6cm

Minimum chip pitch

0.15mm

Maximum load for mounting

100G

Mounting accuracy

±0.01mm

Overall dimensions

L660×W640×H850mm  

Machine weight

About 60kg



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