Description
Description
BGA reballing station with Universal Stencil kit solder ball repair tools Reballing Repair Stencil Soldering Station Kits CPU
Description
1. use of aluminum alloy structure, compact structure and durable.
2.This ball planting table is automatically positioned, no need to manually adjust the center distance, the four positioning holes, four clamping blocks at the locking chip, without a single adjustment, positioning precision, clamping, fast speed, high efficiency of bead.
3. a bead bead and different steel mesh with the use of different sizes, corresponding to the BGA ball. It can be equipped with 80*80mm steel
Packing list:
1 pcs base
1pcs reballing ball stencil with fixture
1pcs solder paste stencil with fixture
1pcs screw adjust
1pcs scraper



Description
1. use of aluminum alloy structure, compact structure and durable.
2.This ball planting table is automatically positioned, no need to manually adjust the center distance, the four positioning holes, four clamping blocks at the locking chip, without a single adjustment, positioning precision, clamping, fast speed, high efficiency of bead.
3. a bead bead and different steel mesh with the use of different sizes, corresponding to the BGA ball. It can be equipped with 80*80mm steel
Packing list:
1 pcs base
1pcs reballing ball stencil with fixture
1pcs solder paste stencil with fixture
1pcs screw adjust
1pcs scraper



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