Description
Description
BGA Balls Reballing Kit Tin Planting Platform for PUM SMC T1 T2 RAM NAND WIFI Power Chips
1.DS-201B is a MacBook tin planting platform, mainly used for tin planting of small BGA chips (including PMU, SMC, T1, T2, RAM, NAND, WIFI, Power Chip).
2. DS-201B (contains 16 steel meshes, 15 steel mesh fixing seats, 2 magnet bases, 9 tin-planting steel plates, and 1 ceramic tin-planting knife)
A1534 16/17 CPU: A1534 16 models 17 models CPU chip steel mesh
SR2NH PCH: 6th and 7th generation PCH south bridge chip steel mesh
CD3217B/CD3215/R4F2113/LFXP2 chip steel mesh
T1 Chip: T1 chip steel mesh
Memory Chips Platform 1-8: DDR3 memory, LPDDR3 memory, DDR4 memory, GDDR5 video memory
1 ND GEN-T2: 1st generation T2 chip steel mesh
2 ND GEN-T2: 2nd generation T2 chip steel mesh
10-11/12-15/16-17SMC: 10 years to 17 years SMC chip steel mesh
SN650801/SN650811/JHL8040R/4208-CRZ/L-FW643E chip steel mesh
MacBook A1534 2015 BGA Chips steel sheet
MacBook A1534 2016-2017 BGA Chips
MAC SSD/NAND/DDR Chips
MacBook BGA Chips steel sheet
MacBook Pro A1706/1707 BGA Chips
MAC WIFI Chips steel sheet
MAC SDD Master Chips steel sheet
MacBook Pro A2159 BGA Chips
T2/PMU/SMC/SSD Control Chips
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