Description
Description
AMTECH flux paste is suitable for cell phone PCB, GBA and PGA and other SMD reflow flux paste, it uses low ionic activator system, fast wetting tin, low smoke, residue after curing the surface of the insulation impedance value is very high, so the electrical interference to cell phones and other communication products is very small, flux paste for the medium activity of the rosin-type flux paste, widely used in the cell phone board of the SMD reflow process. NC-559-ASM is a no-clean flux paste with very light color residue and high SIR value, recommended for BGA, CSP and other ball array solder joint rework and ball repair.
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