Description
Description
Features
Beautiful modeling, easy to use and carry to save operating space. Adopting high quality heating element, the wind is natural and soft, the heat is evenly distributed in the wind mouth, it is easy for the operator to adjust, and can control the temperature and wind volume.
LCD display hot air temperature, digital temperature measurement, the operator to use intuitive, easy to blow soldering, do not need to touch the soldering point of the soldering method, can be eliminated parts displacement and thermal shock.
QFP and SOP type ICs can be soldered, and different air collectors can be used for soldering and desoldering according to the requirements.
Suitable for soldering and desoldering of most surface mounted parts, such as: SOIC CHP, QFP, PLCC, BGA, etc.
It is suitable for desoldering various shielding boxes and covers on circuit boards, shrinking heat-shrinkable tubes, PVC films and polyethylene materials used for connecting metals.
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