
A BGA reballing fixture is a precision tool designed to hold IC chips securely during the reballing process. It aligns the chip with the stencil and prevents movement, ensuring uniform solder ball placement. The fixture works in conjunction with solder stencils, flux, and hot air or infrared rework stations.
Accurate Chip Alignment
Prevents misalignment and solder bridging, especially for high-pin-count BGA chips.
Higher Success Rate
Improves the consistency of solder ball placement, leading to more successful rework outcomes.
Time-Saving
Speeds up manual reballing work in repair shops or production lines.
Supports Multiple Chip Sizes
Ideal for PS4, Xbox, Nintendo Switch chips, laptop GPUs, and more.
Game Console Repairs (e.g., PS4, PS5, Xbox, Nintendo Switch)
Laptop GPU and CPU Chip Reballing
Motherboard and Graphics Card Chip Replacement
Electronics Refurbishing & Chip-Level Repairs
Electronics Repair Technicians
BGA Chip Reballing Service Providers
Laptop & Game Console Repair Shops
Micro Soldering Professionals
OEM / ODM Assembly Lines
CNC-machined aluminum alloy for durability
Universal support for multiple chip sizes
Compatible with most reballing stencils
Anti-slip base for extra stability
Optional custom sizes available
Our professional-grade BGA reballing fixtures are trusted by technicians and repair professionals worldwide. Contact us today for bulk pricing, OEM support, or technical questions!