As the demand for high-performance BGA chips increases in consumer electronics and automotive industries, precise reballing solutions are more essential than ever. Our customizable BGA reballing kits are designed to handle rework needs for a wide range of chips—especially those found in game consoles, cars, and laptops.
Supports a Wide Range of Chip Models
Custom-fit for PlayStation (CXD), Xbox, Switch chips, automotive MCU, and laptop Southbridge/Northbridge ICs.
High Precision Stainless Steel Stencils
Laser-cut or etched to ensure accurate solder ball alignment and high reballing success rates.
Modular and Easy to Use
The press-fit structure ensures quick and accurate chip alignment with minimal operator training required.
Versatile Application Scenarios
Ideal for electronics repair centers, automotive workshops, laptop service stores, and BGA training centers.
OEM Customization Available
Branding, model-specific stencil sizes, and custom mold services are available upon request.
Game Console Chips: CXD series (PS4/PS5), XBOX GPU, Switch main ICs
Automotive Chips: ECU, BMS, dashboard ICs and more
Laptop Chips: Southbridge/Northbridge, GPU, CPU, and other BGA packages
With deep industry knowledge and a dedicated engineering team, we offer complete BGA rework solutions tailored to your repair needs. From kit selection to technical support, we help you repair faster, safer, and smarter.



